Final Screening of Spring Applicants

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Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator


Silicon Valley, CA June 19, 2020 - Silicon Catalyst, the world’s only incubator focused exclusively on accelerating solutions in silicon announces the admission of four additional companies into the semiconductor industry’s highly acclaimed program. The Silicon Catalyst Incubator enables new semiconductor companies to address the challenges in moving from idea to realization, offering early-stage chip startups a coalition of In-Kind and Strategic Partners to dramatically reduce the cost and complexity of development.

The newly admitted companies include:

  • California Memory Technologies

    • DDR Memory Controllers and PHY IP

    • Headquarters: Silicon Valley

  • Multifractal Semiconductors

    • Fully-integrated E-band mmWave front-ends in silicon

    • Headquarters: South Africa

  • Teramics

    • Leading mmWave Solutions

    • Headquarters: Silicon Valley

  • 5D Sensing

    • Advanced CMOS Sensors for Smart City and Safe City applications

    • Headquarters: Israel

Rick Lazansky, Chairman and co-founder of Silicon Catalyst

“I’m very pleased to welcome these 4 companies into our Incubator. It’s especially meaningful to have them join at this time as we enter our 6 th year of operation. Their geographic locations and technology diversity highlight the broad appeal of the incubation process that Silicon Catalyst offers early-stage companies. Our comprehensive ecosystem of Advisors, Strategic and In-Kind Partners, and investors look forward to helping them on their journey to deliver innovative products to their target markets,” stated Pete Rodriguez, CEO of Silicon Catalyst.

New Portfolio Companies in the Silicon Catalyst Incubator - June 2020

California Memory Technologies

Saswat Mishra - CEO
www.memtech.ai

California Memory Technologies is a memory solutions company providing the world’s smallest DDR(Double Data Rate) SDRAM Controllers, PHY IPs, SDK Kits and Firmware using proprietary technology for AI/ML & HPC, Data centers, Automotive and Consumer markets. Our unique architecture gives us the advantage of building the smallest designs (30%-50% smaller than the competition), offering 300+ custom features in Controller and PHY combined for most applications. Memory solutions are also available for persistent memories, like MRAM-DDR3, MRAM-DDR4 and 3D X-point.

Multifractal Semiconductor

Joe Valliarampath, Ph.D - CEO
www.multifractalsemi.com/

Multifractal Semiconductors is developing fully-integrated E-band front-ends in base silicon (CMOS/BiCMOS) as a single IC for the telecoms and automotive markets. Existing E-band links are bulky, expensive, power hungry and not suited for mass production as required by small cell densification and massive MIMO. Our key enabling technology includes actively enhanced high-Q E-band diplexers, which will be integrated with the LNA, PA, switches and mixers - all on-chip. Our customers can feed the output of our IC directly into their digital back-end. This will enable miniaturization of the entire E-band link and for the first time allow E-band small cell and massive MIMO to be realized.

Teramics

Seyed Tabatabaei, Ph.D - CEO
www.teramics.com/

Teramics has developed the most linear and efficient power amplifiers in Ka/Q/V bands. Complementing these innovative power amplifiers are a variety of cutting edge mmWave solutions from Teramics such as low noise amplifiers, and up and down converters. Teramics is also offering integrated solutions for full mmWave phased-array products to be deployed in commercial, defense and space applications.

5DSensing

Roni El-Bahar, Ph.D - CEO
www.5d-sensing.com

5D Sensing has built a unique sensor that solves the “smart camera” sensing technology requirements by adding the 2D night vision, 2D daylight vision, ultra low-light and 3D point cloud into a single CMOS sensor. 5D Sensing is using multiple technologies to make advanced sensors: proprietary AMS readout circuit for the SPAD detector, proprietary time domain signal processing allowing for the capture of both 2D and 3D images concurrently, advanced noise cancellation to implement S-SiPM, wafer bonding, back-side illumination and optical optimizations.