Press Release
January 16, 2025

Silicon Catalyst Partners Nick Kepler and Laura Swan to participate at the 2025 Chiplet Summit

Santa Clara Convention Center, January 21-23

Santa Clara, California, January 16, 2025 - This year’s main topics at the Summit include AI/ML acceleration, the Open Chiplet Economy, advanced packaging methods, die-to-die Interfaces, and working with Foundries. Silicon Catalyst welcomes attendees at the Summit to join Silicon Catalyst Partners at these conference sessions:

Organizer and Moderator:

• Peter Olcott, First Spark Ventures

Panelists:

• Blair Georgakis, Applied Ventures

• Helen Li, Needham

• Laura Swan, Silicon Catalyst Ventures

• Kash Johal, YorChip

Panel Description:

Chiplets are a booming market, so now is the time to find ways to make money in it. Obvious areas are: Chiplets themselves Platforms (hardware and software) Ancillary services. Obviously, the best bets are chiplets for AI/ML because they combine a fast-rising technology with the fastest-rising application ever! Other good bets are cybersecurity, business intelligence, and financial analysis (go where the money is!). Specialized ancillary services (always needed in growing markets) include design services, testing, packaging, and marketing.

B-203: Chiplets in 2030 and How We Got There (Panel)
Laura Swan, General Partner, Silicon Catalyst Ventures
Thursday, January 23 – 3:30 to 4:50 pm
GAMR 3 (Great America Room 3)

Organizer

• Norman Chang, Ansys

Moderator

• Bill Wong, Electronic Design

Panelists:

• Bill Mullen, Ansys

• Bapi Vinnakota, National Advanced Packaging Manufacturing Program (NAPMP)

• Brucek Khailany, NVIDIA

• Laura Swan, Silicon Catalyst Ventures

• Tom Hackenberg, Yole Group

Panel Description:

The five-year horizon for chiplets is very promising. They will make up an ever increasing part of the large chip market, as their cost is more than balanced by the tremendous advantages they bring to chip design and development. More development platforms, operating systems, utilities, and other tools will be available for them. Standardization will be a major issue, as most large customers will want multiple sources as well as large ecosystems and wide support for both development and test. Other issues include achieving higher throughput and lower latency, isolating executing applications from one another, security, and EDA, packaging, integration, and test platform support.

Silicon Catalyst has a booth (#306) in the exhibition hall. We are also pleased to offer a specially arranged conference registration discount – use “CS25SICAT” at checkout – www.chipletsummit.com

Quoting from a recently published Techspot report:

“While chiplets have been around for decades, their use was historically limited to specific, specialized applications. Today, however, they are at the forefront of technology, powering millions of desktop PCs, workstations, servers, gaming consoles, phones, and even wearable devices worldwide. In a matter of a few years, most leading chipmakers have embraced chiplet technology to drive innovation. It's now clear that chiplets are poised to become the industry standard.”